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Plenary Speaker Dr. Philip Wong, Vice President of Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC); Professor, Stanford Co-packaging Heterogeneous Microelectronics and Optical Input/Output (Related Programs: CHIPS, PIPES, Navy: SHIP) Dr. Gordon Keeler; DARPA Mr. Sergey Shumarayev, Intel Dr. Mark Wade, Ayar Labs Mr. Brett Hamilton, Naval Surface Warfare Center (NSWC) Crane 3D Heterogeneous Integration and … Read more
In this episode of The Industrial Packaging Podcast, host Nathan Dube explains the differences between polyolefin, polyethylene, and polyvinyl chloride shrink … This article was gathered automatically by our news bot. We help YouTubers by driving traffic to them for free. The featured image in this article is the thumbnail of the embedded video.